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IBS Electronics: IC Failure Analysis |
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IBS Electronics, Inc. is pleased to announce its Semiconductor Failure Analysis, Reliability and Environmental testing services.
The following are a short list of our services:
Failure Analysis
- I/V characterization (curve trace)
- Microprobing
- Optical microscopic examination
- Chemical or mechanical decapsulation
- Real time X-ray
- Scanning Acoustic Microscopy (C-SAM)
- Scanning Electron Microscopy (SEM) systems
- Energy Dispersive X-ray analysis (EDX)
- Emission Microscopy
- Hot spot analysis
- Chemical Deprocessing
- Plasma etching
- Parallel lapping
- Cross sectioning
- Ball Shear / Bond Pull
Reliability and Environmental Tests
- High Temperature Operating Life
- Temperature Humidity Bias testing
- Highly Accelerated Stress Bias Testing (HAST)
- Temperature Cycling
- Preconditioning per JEDEC-A113, all levels
- Low Temperature Burn-in
- Thermal Shock
- Autoclave (Pressure Cooker) testing
- High Temperature Storage
- Vapor phase/air convection simulation
- Scanning Acoustic Microscopy analysis (C-SAM)
- Mark permanency
- Solderability
- High Power Burn-in
- ESD & Latch up
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