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Emerson & Cuming Adhesives – Chemical Components

For over 50 years, Emerson & Cuming’s focus has been on designing and manufacturing high performance solutions for industries around the world. 

Headquartered in Billerica, MA, Emerson & Cuming operates manufacturing sites in Canton, MA; Westerlo, Belgium; Shanghai, China and Hokkaido, Japan.


  • Chip on Board Die Attach Adhesives
  • Chip On Board Encapsulants
  • Electrically Conductive Adhesives
  • Electrically Conductive Coatings
  • Encapsulants
  • Film Adhesives
  • Solder Alternatives
  • Surface Mount Adhesives
  • Thermal Interface Materials
  • Underfills


Emerson & Cuming Chip on Board Die Attach Adhesives :

Emerson & Cuming offers a wide range of electrically conductive adhesives which have been developed for die and component bonding. Known for their adhesion and resistance to thermal and physical stresses, our die attach adhesives boast favorable dispense properties and customized rheological characteristics.

Emerson & Cuming Chip on Board Die Attach Adhesives Parts

  • 84-1LMI NB High purity, die attach adhesive Screen or Stencil 60,000
  • 84-1LMIT1 Low viscosity, high thermal conductivity, excellent adhesion to gold Syringe 22,000
  • 8700E High temperature resistant, high strength, excellent adhesion to gold Screen or Stencil 19,000
  • 967-1 Low temperature cure Screen or Syringe 14,000
  • 976-1 Flexible, low viscosity Screen or Syringe 9,000
  • XCE 3050 Microelectronic grade, stress absorbing Screen or Stencil 61,000
  • XCE 3051 Microelectronic grade, superior dispense performance (mil spec version available) Screen or Syringe 30,000



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