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| Products: |
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- SolidMatrix® Surface Mount Chip Fuses
- Multilayer Ferrite Chip Beads, Multilayer Ferrite Power Beads and Multilayer Ferrite/Ceramic Inductors
- Process Equipment for Multilayer Ceramic Component
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| Applications:(SolidMatrix® Surface Mount Chip Fuses) |
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Slow-blow Chip Fuse
- High inrush current withstanding capability
- Glass Ceramic Monolithic structure
- Sliver fusing element and silve termination with nickel and tin plating
- Lead-free materials
- Standard EIA 1206 / EIAJ (3216) size
- Symmetrical design with marking on both sides (optional)
- Operating temperature: -55C to 125C (with de-rating)
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Fast Acting Chip Fuse
- Size from 0402 to 1206, current rating from 0.25A to 8.0A and voltage rating from 24-125VAC/DC
- Monolithic structure with glass ceramic body and silver fuse element
- Silver termination with nickel and solder plating(lead free), providing excellent solder ability
- Compatible with both wave and reflow soldering processes
- Operation temperature range:-55oC to +125oC(with de-rating)
- Tape and reel packaging
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| Characteristics: Cross Reference (SolidMatrix® Surface Mount Chip Fuses) |
Cross Reference SolidMatrix® Surface Mount Chip Fuses(Slow-blow Chip Fuse)
| Current Carry Capacity: |
| Size |
Rated Current |
Rated Voltage |
| 1206 |
1A - 2.0A |
63V |
| 1206 |
2.5A -5.0A |
32V |
| 1206 |
6.0A -8.0A |
24V |
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Cross Reference SolidMatrix® Surface Mount Chip Fuses(Fast Acting Chip Fuse)
| Current Carry Capacity: |
| Size |
Rated Current |
Rated Voltage |
| 0402 |
0.25A-4.0A |
24V |
| 0603 |
0.25A-5.0A |
32V |
| 0603 |
6.0A |
24V |
| 1206 |
0.25A-0.375A |
125V |
| 1206 |
0.5A - 2.0A |
63V |
| 1206 |
2.5A - 5.0A |
32V |
| 1206 |
6.0A - 8.0A |
24V |
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| Specifications:(SolidMatrix® Surface Mount Chip Fuses) |
SolidMatrix® Surface Mount Chip Fuses(Slow-blow Chip Fuse)
SolidMatrix® Surface Mount Chip Fuses(Fast Acting Chip Fuse)
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| Applications:(Ferrite Chip Beads) |
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Ferrite Chip Beads
The MCB Series ferrite chip beads for surface mount are manufactured with AEM's unique multilayer process and equipment technologies as well as proprietary materials, including ferrites, internal electrode ink and termination paste.
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Ferrite Chip Bead Arrays
The Multilayer Ferrite Chip Bead Array retains all the features of Multilayer Ferrite Chip Beads. In addition, it provides multiple circuits in a single package, which reduce the required land space on PCB and reduce the cost for assembly. Complete Datasheet.
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Ferrite Power Beads
Monolithic structure for closed megnetic path and high reliability with superior termination bonding strength.
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Ferrite Inductors
The MCI series multilayer ferrite chip inductors for surface mount are manufactured in the U.S.A., with AEM's unique multilayer process and equipment technologies as well as proprietary materials, including ferrites, internal electrode ink and termination paste.
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Ceramic Inductors
High quality ceramic material and unique manufacturing processes provide high Q at high frequency and high self-resonant frequency.
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Land Pattern and Soldering Temperature
Recommended PC Board land patterns and tempurature profiles for soldering.
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Packaging and Storage
AEM's multilayer components are provided on tape-and-reel for use in pick-and-place machines or in bulk for special applications.
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Reliability Tests
Comparison of reliability tests.
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| Characteristics:(Ferrite Chip Beads) |
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| Specifications:(Ferrite Chip Beads) |
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AEM Electronics (USA), Inc. is an award-winning high-tech company serving the information and telecommunication industries with