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Hysol Adhesive – Chemical Components

Henkel acquired Hysol from Dexter. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol is synonymous with reliability, performance, cost effectiveness and ease-of-use. Through years of dedicated research and expertise gained from practical, in-field applications, Hysol has a full suite of materials solutions for modern semiconductor and electronics packaging processes.

Henkel, headquartered in Düsseldorf, Germany, has about 55,000 employees worldwide and is among the most internationally aligned German-based companies in the global marketplace. People in approximately 125 countries around the world trust in brands and technologies from Henkel. 

In 1999, Henkel Corporation acquired The Dexter Corporation and has continued the unrivalled product development and leading-edge manufacturing solutions that have been associated with the Hysol brand name since its inception. 


  • Coatings
  • Molding
  • Potting & Encapsulating

Hysol Coatings:

A layer of a substance applied onto a surface for protection or to enhance visual aesthetics.

Hysol Molding :

To create a shape or form using powder or liquids.

Hysol Potting & Encapsulating:

Compounds used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from the exposure to chemicals, moisture, mechanical shock and vibration.




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