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Home > Connectors > Headers & Wire Housings > Molex 44032-0501 Connector Micro-Fit 3.0(TM) Header

Molex 44032-0501 Connector Micro-Fit 3.0(TM) Header

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Molex 44032-0501 Connector 2.30mm (.484") Pitch COMPODRE(TM) Micro-Fit 3.0(TM) Header Pod, Surface Mount Compatible, Dual Row, Vertical, 6 Circuits, 3.18mm (.125") PCB Thickness, Tin (Sn) Plating

Molex 44032-0501 Connector Micro-Fit 3.0(TM) Header

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Molex 44032-0501 2.30mm (.484") Pitch COMPODRE(TM) Micro-Fit 3.0(TM) Header Pod Surface Mount Compatible Dual Row Vertical 6 Circuits 3.18mm (.125") PCB Thickness Tin (Sn) Plating
Molex's Micro-Fit 3.0 Connector System offers a 3.00mm pitch, an 8.5A maximum current rating and many design options such as a terminal position assurance, blind-mating and compliant pin features. Available in multiple circuit sizes and cable lengths for power applications, the Micro-Fit 3.0 Connector System delivers power in a compact package in wire-to-wire and wire-to-board configurations.

Molex's Micro-Fit 3.0 BMI Connectors are designed for blind-mating applications and allow mating misalignment. The Micro-Fit TPA Connectors help prevent failure in end products by offering terminal position assurance (TPA). Micro-Fit 3.0 CPI (Compliant Pin) connectors provide a compliant pin interface while maintaining all features of a standard Micro-Fit 3.0 Connector. Molex's Micro-Fit 3.0 RMF (Reduced Mating Force) Terminals are designed for applications needing lower engagement and disengagement forces or when the units are cycles frequently.

Features & Benefits:

Fully isolated terminals protect against potential damage of terminals during handling and mating and minimize shorting risks due debris.
High-temperature LCP headers withstand 260°C IR reflow processes.
SMT, press-fit or surface-mount compatible versions available to provide design flexibility and offer options to meet many application needs.
Locking tang on terminal secures terminals in housings.
Positive latching ensures a reliable connection.
Optional terminal position assurance features reduce assembly error that results in terminal back-outs.
Fully polarized housings prevent accidental mismating.
Fitting nails and solderable clips available offer header retention and strain relief options.
BMI wire-to-wire and wire-to-board connector offer full range of options for every application and orientation.
BMI provides a self-aligning feature molded into housings to allow up to 2.54mm misalignment.
CPI connectors use eye-of-the-needle press-fit design provides a reliable connection.
RMF terminals provide reduction in engagement and disengagement forces support ergonomics and user-friendly interface.
RMF terminals are available in 20 to 30 AWG to deliver design flexibility for a broad range of applications.
Applications:

Automotive
Harness Manufactures
Inside Devices
Non-Sealed Applications
Consumer
Dryers
Freezers
Gaming Machines
Printers
Scanner
Security Systems
Vending Machines
Washing Machines
White Goods
Medical
Diagnostic Equipment
Patient Monitor
Sustainable Energy
Solar Power
Telecommunications/Networking
Routers
Servers
Storage

Additional Information

44032-0501
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