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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities
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1.26.2026
TSMC’s Strategic Shift: Why “Packaging Slots” Are Emerging as the Next AI-Era Constraint
TSMC is prioritizing advanced packaging for AI/HPC chips while rebalancing mature-node production to overseas sites, impacting procurement and supply chains.
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1.26.2026
China’s Mature-Node Chip Expansion in 2026: Market Impact & Risk
China’s mature-node expansion heads into tool install and early ramp in 2026. IBS broke what it means for pricing, lead times, and sourcing risk.
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1.26.2026
Optalysys Raises US$31M to Push Silicon Photonics Into Commercial “Encrypted Compute” Hardware
AI infrastructure is no longer limited by compute alone. Power constraints, data movement bottlenecks, and security overhead are now shaping the future of AI systems.
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1.22.2026
Micron Acquires PSMC Taiwan Fab for $1.8B to Expand Long-Term DRAM Capacity
Micron plans to acquire PSMC’s P5 fab in Taiwan for $1.8B, targeting long-term DRAM capacity expansion amid AI-driven memory demand and tight supply conditions.
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1.22.2026
Indonesia Funds a Semiconductor “Catch-Up” Push: Up to $1B in Potential Commitments Plus a $125M Arm Collaboration
Indonesia prepares $250M in semiconductor funding, targets up to $1B in total investment, and partners with Arm to build chip design and ecosystem capacity.
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1.21.2026
Baya Systems Expands Bengaluru Engineering Hub to Support AI, Automotive, and HPC Innovation
Baya Systems expands its Bengaluru engineering hub to scale unified fabric technology for AI, HPC, and chiplet-based semiconductor architectures.
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1.21.2026
South Korea Plans $159M R&D Push Across Semiconductors, Displays, and Batteries
South Korea plans a $159M R&D investment across semiconductors, displays, and batteries—targeting advanced packaging, memory-centric AI architectures, and automotive compute for software-defined vehicles.
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1.20.2026
Viettel Breaks Ground on Vietnam’s First Semiconductor Fab
Viettel has started building a 27-hectare chip fabrication plant at Hoa Lac Hi-Tech Park near Hanoi, aiming for trial production by late 2027. What this means for Vietnam’s semiconductor ecosystem—and why it matters for long-cycle sourcing.
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1.20.2026
EIB Backs METLEN Gallium Production in Greece
The EIB approved €90M for METLEN’s bauxite upgrades and a new gallium facility in Greece—an EU move to de-risk critical inputs for RF and power semiconductors.
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1.19.2026
U.S. Imposes 25% Tariff on Select AI Chips With Key Exemptions
The U.S. introduces a 25% Section 232 tariff on select advanced AI chips, with major exemptions for data centers, R&D, startups, and U.S. industrial use.
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