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IBS Electronics: IC Failure Analysis

IBS Electronics, Inc. is pleased to announce its Semiconductor Failure Analysis, Reliability and Environmental testing services. The following are a short list of our services:

Failure Analysis

  • I/V characterization (curve trace)
  • Microprobing
  • Optical microscopic examination
  • Chemical or mechanical decapsulation
  • Real time X-ray
  • Scanning Acoustic Microscopy (C-SAM)
  • Scanning Electron Microscopy (SEM) systems
  • Energy Dispersive X-ray analysis (EDX)
  • Emission Microscopy
  • Hot spot analysis
  • Chemical Deprocessing
  • Plasma etching
  • Parallel lapping
  • Cross sectioning
  • Ball Shear / Bond Pull

We take faulty chips and analyze them, isolate the failure, and pinpoint the reason.

Reliability and Environmental Tests

  • High Temperature Operating Life
  • Temperature Humidity Bias testing
  • Highly Accelerated Stress Bias Testing (HAST)
  • Temperature Cycling
  • Preconditioning per JEDEC-A113, all levels
  • Low Temperature Burn-in
  • Thermal Shock
  • Autoclave (Pressure Cooker) testing
  • High Temperature Storage
  • Vapor phase/air convection simulation
  • Scanning Acoustic Microscopy analysis (C-SAM)
  • Mark permanency
  • Solderability
  • High Power Burn-in
  • ESD & Latch up