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Printed Circuit Board Manufacturing:

IBS Electonics Printed Circuit Board Manufacturing.

IBS Electronics preserves its position in the market of high mix low/medium volume with fast delivery to produce high quality level of printed circuit board up to 20 layers. The notion of “Speed” is echoed throughout the whole company management activities. “Service beyond Expectation” is our persistent customer service philosophy. IBS Electronics circuits gets the U.S. UL Safety Certificate (UL File No: E301546) including normal FR4 material, aluminum base and high-frequency rogers material and has the perfect ISO9001 Quality Management System approved by SGS. In addition our products meet the RoHS standard certified by the SGS.

IBS ELECTRONICS Circuits Technical Specification

Technical Specification
SeqItemStandardAdvancedRemarks
1Number of Layer1-10 Layers12-16 Layers
2Base MaterialFR4(High TG), Teflon, Rogers, Aluminum Based
3Finish Board Thickness0.30 mm ~ 3.20 mm
(8 mil ~ 126 mil)
0.20 mm ~ 4.5 mm
(5 mil ~ 177 mil)
4Minimum Core Thickness0.15mm (6 mil)0.10mm (4 mil)
5Copper ThicknessMin. 1/2 OZ, Max. 4 OZMin. 1/3 OZ, Max. 6 OZSelective Area
Available,
Thicker Cu On
Request
6Min.Trace
Wide&Line Space
Single Sided0.13 mm (5 mil)0.10mm (4 mil)
Double Sided0.13 mm (5 mil)0.10mm (4 mil)
7Min. Hole
Diameter
Drilling /PTHf0.20 mm (8 mi )f0.20 mm (8 mil)
Punchingf1.0 mm (40 mil)f0.90 mm (36 mil)If Necessary
8Dimension
Tolerance
Hole Position0.08 (3 mil)
Conductor Width(W)20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Hole Diameter(H)NPTH:+/-0.05 mm (2 mil)NPTH:+/-0.05 mm (2 mil)
PTH: +/-0.075 mm (3 mil)PTH: +/-0.05 mm (2 mil)
Outline Dimension0.13 mm (5 mil)0.10 mm (4 mil)
Conductors & Outline
( C – O )
0.15 mm (6 mil)0.13 mm (5 mil)
Warp and Twist0.75%0.50%
9Surface Treatment On Land AreaLeadfree HASL, Entek, Immersion Silver, Immersion
Tin, Golden Finger, OSP
10V-CuttingPanel Size457.2mm X 622 mm (max.)457.2mm X 800 mm (max.)
Board Thickness0.50 mm (20mil) min.0.30 mm (12mil) min.
Remain Thickness1/3 board thickness0.40 +/-0.10mm
(16+/-4 mil)
Tolerance±0.13 mm (5mil)±0.1 mm (4 mil)
Groove Width0.50 mm (20mil) max.0.38 mm (15 mil) max.
Groove to Groove20 mm (787mil) min.10 mm (394 mil) min.
Groove to Trace0.45 mm (18mil) min.0.38 mm (15 mil) min.
11SlotSlot size tol.L=2WPTH Slot: L:+/-0.13 (5 mil) W:+/-0.08 (3 mil)PTH Slot: L:+/-0.10 (4 mil) W:+/-0.05 (2 mil)(1) L=Length of slot
(2) W=Width of slot
(3) Min.drill bit size
for multi-hit is
0.60mm
NPTH slot(mm) L+/-0.10
(4 mil) W:+/-0.0 5 (2 mil)
NPTH slot(mm) L:+/-0.08
(3 mil) W:+/-0.05 (2 mil)
12Min Spacing
from hole
edge to
hole edge
0.30-1.60
(Hole Diameter)
0.15mm (6mil)0.10mm (4mil)
1.61-6.50
(Hole Diameter)
0.15mm (6mil)0.13mm (5mil)
13Minimum spacing between hole edge
to circuitry pattern
PTH hole: 0.20mm (8mil)PTH hole: 0.13mm (5mil)
NPTH hole: 0.18mm (7mil)NPTH hole: 0.10mm (4mil)
14Image transfer
Registration tol
Circuit pattern vs.
index hole
0.10 (4mil)0.08 (3mil)
Circuit patten vs.2nd
drill hole
0.15 (6mil)0.10 (4mil)
15Registration tolerance of front/back image0.075mm (3mil)0.05mm (2mil)
16MultilayersLayer-layer misregistration4 layers:0.15mm (6mil) max.4 layers:0.10mm (4mil) max.
6 layers:0.20mm (8mil) max.6 layers:0.13mm (5mil) max.
8 layers:0.25mm (10mil) max.8 layers:0.15mm (6mil) max.
Min.Spacing From
Hole Edge
to Innerlayer Pattern
0.225mm (9mil)0.15mm (6mil)
Min.Spacing From Outline to
Innerlayer Pattern
0.38mm (15mil)0.225mm (9mil)
Min. board thickness4layers:0.30mm (12mil)4layers:0.20mm (8mil)
6layers:0.60mm (24mil)6layers:0.50mm (20mil)
8layers:1.0mm (40mil)8layers:0.75mm (30mil)
Board thickness tolerance4layers:+/-0.13mm (5mil)4layers:+/-0.10mm (4mil)
6layers:+/-0.15mm (6mil)6layers:+/-0.13mm (5mil)
8-12 layers:+/-0.20mm (8mil)8-12 layers:+/-0.15mm (6mil)
17Insulation Resistance10KO~20MO(typical:5MO)
18Conductivity<50O(typical:25O)
19Test voltage250V
20Impedance controlTypical: 50O+/-10%