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Printed Circuit Board Manufacturing:

IBS Electonics Printed Circuit Board Manufacturing.

IBS Electronics preserves its position in the market of high mix low/medium volume with fast delivery to produce high quality level of printed circuit board up to 20 layers. The notion of “Speed” is echoed throughout the whole company management activities. “Service beyond Expectation” is our persistent customer service philosophy. IBS Electronics circuits gets the U.S. UL Safety Certificate (UL File No: E301546) including normal FR4 material, aluminum base and high-frequency rogers material and has the perfect ISO9001 Quality Management System approved by SGS. In addition our products meet the RoHS standard certified by the SGS.

IBS ELECTRONICS Circuits Technical Specification

Technical Specification
Seq Item Standard Advanced Remarks
1 Number of Layer 1-10 Layers 12-16 Layers
2 Base Material FR4(High TG), Teflon, Rogers, Aluminum Based
3 Finish Board Thickness 0.30 mm ~ 3.20 mm
(8 mil ~ 126 mil)
0.20 mm ~ 4.5 mm
(5 mil ~ 177 mil)
4 Minimum Core Thickness 0.15mm (6 mil) 0.10mm (4 mil)
5 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 6 OZ Selective Area
Available,
Thicker Cu On
Request
6 Min.Trace
Wide&Line Space
Single Sided 0.13 mm (5 mil) 0.10mm (4 mil)
Double Sided 0.13 mm (5 mil) 0.10mm (4 mil)
7 Min. Hole
Diameter
Drilling /PTH f0.20 mm (8 mi ) f0.20 mm (8 mil)
Punching f1.0 mm (40 mil) f0.90 mm (36 mil) If Necessary
8 Dimension
Tolerance
Hole Position 0.08 (3 mil)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Hole Diameter(H) NPTH:+/-0.05 mm (2 mil) NPTH:+/-0.05 mm (2 mil)
PTH: +/-0.075 mm (3 mil) PTH: +/-0.05 mm (2 mil)
Outline Dimension 0.13 mm (5 mil) 0.10 mm (4 mil)
Conductors & Outline
( C – O )
0.15 mm (6 mil) 0.13 mm (5 mil)
Warp and Twist 0.75% 0.50%
9 Surface Treatment On Land Area Leadfree HASL, Entek, Immersion Silver, Immersion
Tin, Golden Finger, OSP
10 V-Cutting Panel Size 457.2mm X 622 mm (max.) 457.2mm X 800 mm (max.)
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm
(16+/-4 mil)
Tolerance ±0.13 mm (5mil) ±0.1 mm (4 mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15 mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394 mil) min.
Groove to Trace 0.45 mm (18mil) min. 0.38 mm (15 mil) min.
11 Slot Slot size tol.L=2W PTH Slot: L:+/-0.13 (5 mil) W:+/-0.08 (3 mil) PTH Slot: L:+/-0.10 (4 mil) W:+/-0.05 (2 mil) (1) L=Length of slot
(2) W=Width of slot
(3) Min.drill bit size
for multi-hit is
0.60mm
NPTH slot(mm) L+/-0.10
(4 mil) W:+/-0.0 5 (2 mil)
NPTH slot(mm) L:+/-0.08
(3 mil) W:+/-0.05 (2 mil)
12 Min Spacing
from hole
edge to
hole edge
0.30-1.60
(Hole Diameter)
0.15mm (6mil) 0.10mm (4mil)
1.61-6.50
(Hole Diameter)
0.15mm (6mil) 0.13mm (5mil)
13 Minimum spacing between hole edge
to circuitry pattern
PTH hole: 0.20mm (8mil) PTH hole: 0.13mm (5mil)
NPTH hole: 0.18mm (7mil) NPTH hole: 0.10mm (4mil)
14 Image transfer
Registration tol
Circuit pattern vs.
index hole
0.10 (4mil) 0.08 (3mil)
Circuit patten vs.2nd
drill hole
0.15 (6mil) 0.10 (4mil)
15 Registration tolerance of front/back image 0.075mm (3mil) 0.05mm (2mil)
16 Multilayers Layer-layer misregistration 4 layers: 0.15mm (6mil) max. 4 layers: 0.10mm (4mil) max.
6 layers: 0.20mm (8mil) max. 6 layers: 0.13mm (5mil) max.
8 layers: 0.25mm (10mil) max. 8 layers: 0.15mm (6mil) max.
Min.Spacing From
Hole Edge
to Innerlayer Pattern
0.225mm (9mil) 0.15mm (6mil)
Min.Spacing From Outline to
Innerlayer Pattern
0.38mm (15mil) 0.225mm (9mil)
Min. board thickness 4layers:0.30mm (12mil) 4layers:0.20mm (8mil)
6layers:0.60mm (24mil) 6layers:0.50mm (20mil)
8layers:1.0mm (40mil) 8layers:0.75mm (30mil)
Board thickness tolerance 4layers:+/-0.13mm (5mil) 4layers:+/-0.10mm (4mil)
6layers:+/-0.15mm (6mil) 6layers:+/-0.13mm (5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
17 Insulation Resistance 10KO~20MO(typical:5MO)
18 Conductivity <50O(typical:25O)
19 Test voltage 250V
20 Impedance control Typical: 50O+/-10%