TSMC's Advanced Backend Fab 6 Sets the Stage for Future Innovation
Taiwan Semiconductor Manufacturing Company (TSMC) has achieved a significant milestone with the opening of its Advanced Backend Fab 6, marking a major step forward in the expansion of its 3DFabric™ system integration technology. This state-of-the-art facility represents TSMC's first all-in-one automated advanced packaging and testing fab, enabling seamless integration of front-end to back-end processes and testing services.
The establishment of Advanced Backend Fab 6 is a significant development for TSMC, as it prepares for the mass production of TSMC-SoIC™ (System on Integrated Chips) process technology. This cutting-edge fab will provide TSMC with the flexibility to allocate capacity for advanced packaging and silicon stacking technologies like SoIC, InFO (Integrated Fan-Out), CoWoS (Chip-on-Wafer-on-Substrate), and advanced testing. By integrating these technologies, TSMC aims to enhance production yield and efficiency, ensuring optimal performance for high-performance computing (HPC), artificial intelligence (AI), mobile applications, and other innovative products.
The construction of Advanced Backend Fab 6 began in 2020, with the goal of supporting the next generation of technological advancements. TSMC recognizes the importance of empowering its customers to achieve product success and seize market opportunities. With this state-of-the-art facility, TSMC can cater to the increasing demands of its customers by offering advanced packaging solutions and testing services.
Situated in Zhunan Science Park, Taiwan, Fab 6 covers an extensive base area of 14.3 hectares, making it TSMC's largest advanced backend fab to date. Equipped with cutting-edge equipment and technologies, including a five-in-one intelligent automatic material handling system, an agile dispatching system, and a robust die-level big data quality defense network, Fab 6 positions TSMC at the forefront of innovation.
In line with TSMC's dedication to intelligent manufacturing, Advanced Backend Fab 6 incorporates cutting-edge technologies to optimize production efficiency. The fab features a five-in-one intelligent automatic material handling system, spanning a total length of more than 32 kilometers.
This system ensures smooth movement of wafers and dies throughout the manufacturing process, connecting production information with agile dispatching systems to reduce production cycle times. Leveraging artificial intelligence capabilities, the fab can execute precise process control, identify abnormalities in real-time, and establish a robust die-level big data quality defense network. With an impressive data processing capacity that is 500 times greater than a front-end fab, Advanced Backend Fab 6 ensures comprehensive die traceability, constructing a complete production history for each die.
TSMC's Advanced Backend Fab 6 sets a new standard in the semiconductor industry, enabling seamless integration of front-end to back-end processes and testing services. With its advanced packaging technologies and intelligent manufacturing systems, TSMC is well-positioned to meet the increasing demands of the market and empower its customers to excel in their respective industries. This milestone marks yet another step forward in TSMC's commitment to driving innovation and delivering cutting-edge solutions to the world.