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U.S. Government Invests $3 Billion in Advanced Packaging Manufacturing

Published: 11.28.2023

The U.S. government is investing $3 billion in the National Advanced Packaging Manufacturing Program (NAPMP) to help U.S. manufacturers adopt new technology and create a sustainable, profitable, and environmentally sound high-volume advanced packaging industry in the country.

The NAPMP is one of four CHIPS for America R&D programs, along with the National Semiconductor Technology Center (NSTC), Manufacturing USA institute(s), and CHIPS R&D Metrology. These programs are part of a larger effort by the U.S. government to strengthen the domestic semiconductor industry and reduce reliance on foreign manufacturing.

Recognizing the importance of a skilled workforce, the NAPMP will also allocate funds for workforce training programs to operate and maintain advanced packaging equipment and processes, ensuring that the industry has the talent it needs to thrive.

The NAPMP will provide funding for projects focused on various critical areas of advanced packaging. These areas include:

  • Materials and substrates: Developing innovative materials and substrates that can handle the demands of advanced packaging.
  • Equipment, tools, and processes: Advancing the development of new equipment, tools, and processes for advanced packaging.
  • Power delivery and thermal management: Addressing the challenges of power delivery and thermal management in advanced packaging.
  • Photonics and connectors: Enhancing the integration of photonics and connectors in advanced packaging.
  • Chiplet ecosystem: Fostering the development of a robust chiplet ecosystem, including standards and interfaces.
  • Co-design for test, repair, security, interoperability, and reliability: Integrating test, repair, security, interoperability, and reliability considerations into the design of advanced packaging solutions.

"Within a decade, we envision that America will both manufacture and package the world's most sophisticated chips," stated Laurie Locascio, director of the National Institute of Standards and Technology (NIST). "This means both onshoring a high-volume advanced packaging industry that is self-sustaining, profitable, and environmentally sound, and conducting the research to accelerate new packaging approaches to market."

The NAPMP marks a significant step forward in the U.S. government's commitment to revitalizing the semiconductor industry. By investing in advanced packaging, the government is laying the foundation for a more resilient, secure, and prosperous domestic semiconductor ecosystem.

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