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BOYD 374724B60024G
374724B60024G,BOYD,HEAT SINK PASSIVE BGA/FPGA PIN ARRAY ADHESIVE ALUMINUM 15.3DEGC/W BLACK ANODIZED
374724B60024G BY BOYD LACONIA LLC IS A HIGH-PERFORMANCE COMPONENT DESIGNED FOR INDUSTRIAL APPLICATIONS FEATURING ROBUST CONSTRUCTION PRECISE SPECIFICATIONS AND RELIABLE OPERATION TAILORED TO DEMANDING ENVIRONMENTS.
Purchase
Availability
1,412
Ships in 10 Days
1,412
Lead Time (weeks)
6
Unit Price
$11.4351
Total Price
$114.351
Minimum: 10
1 -
49
$11.4351
50
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99
$7.9947
100
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209
$7.473
210
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419
$7.2474
420
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629
$6.9513
630
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839
$6.8808
840
+
$6.8103
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