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BOYD 7717-44DAPG
7717-44DAPG,BOYD LACONIA LLC,HEAT SINKS SEMICONDUCTOR MOUNTING PAD FOR TO-18 CIRCULAR DIALYL PHTHALATE (DAP) 3.18X7.75MM
7717-44DAPG BY BOYD LACONIA LLC IS A SEMICONDUCTOR MOUNTING HEAT SINK PAD FOR TO-18 PACKAGES MADE OF DIALLYL PHTHALATE DAP WITH DIMENSIONS 3.18MM X 7.75MM DESIGNED FOR EFFICIENT THERMAL MANAGEMENT.