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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities
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4.2.2026
Intel Signals Broader External Push for 18A as Foundry Strategy Evolves
Intel CFO David Zinsner said Intel may broaden the external role of its 18A process, signaling a shift in foundry strategy as yield progress improves and interest in 18A-P grows.
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4.2.2026
AI-Driven Memory Shortage Could Last 4 to 5 More Years as HBM Demand Tightens Wafer Supply
SK Group warns the memory shortage could last another four to five years as AI and HBM demand strain wafer supply. Micron, Samsung, SK hynix, and Gartner all point to prolonged DRAM and NAND tightness.
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4.1.2026
Canada Expands Defense Tech Investment with Focus on Quantum and Domestic Electronics Capacity
Canada is investing over C$900 million in defense and dual-use technologies, including quantum computing, communications, and sensors, as part of its new Defence Industrial Strategy.
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4.1.2026
India Expands Semiconductor Push as Micron Sanand Plant Begins Shipping Memory Modules
India accelerates its semiconductor strategy as Micron’s Sanand plant ships its first memory modules while New Delhi seeks equipment investment from Dutch firms.
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3.31.2026
Nanya Raises About $2.5 Billion in Strategic Funding as AI Demand Reshapes DRAM Supply
Nanya Technology raised about $2.5 billion in strategic funding tied to Sandisk, Solidigm, Kioxia, and Cisco as AI demand drives tighter DRAM supply and long-term sourcing deals.
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3.31.2026
Canada Expands Defense Tech Investment with Focus on Quantum and Domestic Electronics Capacity
Canada is investing over C$900 million in defence and dual-use technologies, including quantum computing, communications, and sensors, as part of its new Defence Industrial Strategy.
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3.30.2026
Elon Musk Launches TERAFAB in Texas to Internalize Chip Supply for Tesla, SpaceX, and xAI
Elon Musk has unveiled TERAFAB in Texas, a chip manufacturing initiative for Tesla, SpaceX, and xAI targeting logic, memory, advanced packaging, and terawatt-scale compute.
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3.30.2026
Aixtron to Build Malaysia Plant for Compound Semiconductor Deposition Equipment
Aixtron will build a new plant in Penang, Malaysia for selected compound semiconductor deposition equipment, with first tool shipments expected in 2027.
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3.25.2026
AI-Driven Memory Shortage Could Last 4 to 5 More Years as HBM Demand Tightens Wafer Supply
SK Group chairman Chey Tae-won says the current memory shortage could continue until 2030 as AI and HBM demand strain wafer supply. Here is what Micron, Samsung, IDC, Gartner, and SK hynix signals say about the trend.
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3.25.2026
Analog Devices Expands Backend Capacity in Thailand to Strengthen Supply Chain Resilience
Analog Devices has opened a new manufacturing site in Thailand to expand test, wafer-level processing, chip-scale packaging, and final IC test capacity, strengthening analog semiconductor supply resilience in Asia-Pacific.
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