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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities
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3.24.2026
Taiwan Power Costs and Material Risks Could Impact Component Availability
Taiwan remains central to the AI hardware supply chain, but rising power costs and material disruptions could affect semiconductor output and component lead times. Here’s what buyers should watch and how to prepare.
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3.24.2026
Murata’s Rare-Earth Supply Shift Signals Future Sourcing Risk for High-Spec MLCCs
Murata’s move to separate its China rare-earth supply chain signals future sourcing risk for high-spec MLCCs used in automotive, industrial, and AI hardware.
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3.19.2026
Cortical Labs Brings Biological Computing to Melbourne and Singapore Data Centers
Cortical Labs is moving biological computing into real infrastructure with a Melbourne bio data center and a planned Singapore site, raising new questions around low-power compute and future architectures.
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3.18.2026
AI Infrastructure Spending Expands Into Power Delivery as Amber Semi Raises $30M
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3.18.2026
Infineon and Subaru Partner on Next-Generation ADAS Safety and Real-Time Vehicle Control
Infineon and Subaru are collaborating on an automotive MCU for future Subaru vehicles, targeting faster, more reliable ADAS processing, sensor fusion, and integrated vehicle motion control.
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3.17.2026
Ayar Labs and Wiwynn Partner on Co-Packaged Optics for Rack-Scale AI Systems
Ayar Labs and Wiwynn are partnering to bring co-packaged optics into rack-scale AI systems. Here is what the move means for hyperscale AI infrastructure, liquid cooling, optical interconnects, and what the market should watch next.
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3.17.2026
Meta Expands In-House AI Chip Roadmap With Broadcom as GenAI Inference Demand Accelerates
Meta announced four new generations of in-house AI chips over the next two years, with Broadcom reportedly supporting design work. Here is what the MTIA roadmap means for GenAI inference, hyperscale AI infrastructure, and the broader semiconductor market.
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3.16.2026
Philippine Electronics Exports Could Break $50 Billion in 2026 but Energy Costs Are Emerging as a Risk
Philippine electronics exports may top $50 billion in 2026, but rising oil, transport, and power costs tied to Middle East tensions could pressure semiconductor and electronics exporters.
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3.16.2026
Helium Supply Disruption Raises New Semiconductor Manufacturing Risk after Conflict in Iran
Helium supply disruption in Qatar is raising new risks for semiconductor manufacturing. Learn how specialty gases, bromine, logistics, and energy costs could impact chip supply chains.
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3.12.2026
Intel Signals Broader External Push for 18A as Foundry Strategy Evolves
Intel CFO David Zinsner said Intel may broaden the external role of its 18A process, signaling a shift in foundry strategy as yield progress improves and interest in 18A-P grows.
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